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Si7530DP
Vishay Siliconix
N- and P-Channel 60-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
R DS(on) ( Ω )
I D (A)
Q g (Typ.)
? Halogen-free According to IEC 61249-2-21
Available
N-Ch
P-Ch
60
- 60
0.075 at V GS = 10 V
0.100 at V GS = 4.5 V
0.064 at V GS = - 10 V
0.080 at V GS = - 4.5 V
4.6
4.0
- 5.0
- 4.5
12 nC
47
? TrenchFET ? Power MOSFET
? New Low Thermal Resistance PowerPAK ?
Package with Low 1.07 mm Profile
? 100 % R g Tested
PowerPAK SO-8
D 1
S 2
6.15 mm
1
S1
G1
5.15 mm
2
S2
3
4
G2
G 2
8
D1
7
D1
D2
G 1
6
5
D2
Bottom View
Ordering Information: Si7530DP-T1-E3 (Lead (Pb)-free)
Si7530DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
S 1
N-Channel MOSFET
D 2
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
10 s Steady
P-Channel
10 s Steady
Unit
Drain-Source Voltage
Gate-Source Voltage
V DS
V GS
60
± 20
- 60
V
Continuous Drain Current (T J = 150 °C) a
Pulsed Drain Current
T A = 25°C
T A = 70°C
I D
I DM
4.6
3.6
15
3.0
2.4
- 5.0
- 4.0
- 25
- 3.2
- 2.6
A
Continuous Source Current (Diode Conduction) a
I S
2.7
1.2
- 2.9
- 1.2
Single Pulse Avalanche Current
Single Pulse Repetitive Avalanche Energy b
L = 0.1 mH
I AS
E AS
15
11
- 22
24.2
mJ
Maximum Power Dissipation a
T A = 25°C
T A = 70°C
P D
3.3
2.1
1.4 3.5
0.9 2.2
1.5
0.94
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) c, d
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
N-Channel
Typical Maximum
P-Channel
Typical Maximum
Unit
Maximum Junction-to-Ambient a
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
Steady State
R thJA
R thJC
29 38
60 85
4.0 5.2
27 36
60 85
3.3 4.3
°C/W
Notes:
a. Surface Mounted on 1” x 1” FR4 board.
b. Duty Cycle ≤ 1 %.
c. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73249
S09-0223-Rev. D, 09-Feb-09
www.vishay.com
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